【英文标准名称】:Non-cellulosicpapersforelectricalpurposes-Part2:Methodsoftest(IEC60819-2:2001);GermanversionEN60819-22001
【原文标准名称】:电工用非纤维素纸.第2部分:试验方法
【标准号】:EN60819-2-2001
【标准状态】:现行
【国别】:
【发布日期】:2002-07
【实施或试行日期】:2002-07-01
【发布单位】:欧洲标准学会(EN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:测试;非纤维素;规范;电绝缘材料;电气工程;玻璃;绝缘纸;纤维;纸;芳族聚酰胺;聚酰胺纸;规范(验收);绝缘材料;无纺织织物
【英文主题词】:Aramide;Electricalengineering;Electricalinsulatingmaterials;Fibres;Glass;Insulatingmaterials;Insulatingpapers;Non-cellulosic;Non-wovenfabrics;Paper;Polyamidepapers;Specification;Specification(approval);Testing
【摘要】:
【中国标准分类号】:K15
【国际标准分类号】:29_035_10
【页数】:16P.;A4
【正文语种】:英语


【英文标准名称】:Environmentaltesting-Tests-TestTd-Testmethodsforsolderability,resistancetodissolutionofmetallizationandtosolderingheatofsurfacemountingdevices(SMD)
【原文标准名称】:环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法
【标准号】:BSEN60068-2-58-2004
【标准状态】:现行
【国别】:英国
【发布日期】:2004-11-19
【实施或试行日期】:2004-11-19
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:铜焊;组件;定义;定义(术语);溶解;电气器具;电气设备;电气元件;电气工程;电子工程;电子设备及元件;环境测试;架设(施工作业);热浸涂敷;喷镀金属;表面安装设备;软钎焊性;软钎焊性试验;软钎焊;金属熔化槽方法;焊接热;耐钎焊温度;钎焊;材料强度;表面安装装置;试验;测试条件;热稳定性
【英文主题词】:Brazing;Components;Definition;Definitions;Dissolution;Electricappliances;Electricalappliances;Electricalcomponents;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Erecting(constructionoperation);Hotdipcoating;Metallization;SMD;Solderability;Solderabilitytesting;Soldering;Solderingbathmethod;Solderingheat;Solderingtemperatureresistance;Solderings;Strengthofmaterials;Surfacemountingdevices;Testing;Testingconditions;Thermalstability
【摘要】:ThispartofIEC60068outlinestestTd,applicabletosurfacemountingdevices(SMD),whichareintendedtomountonsubstrates.Thisstandardprovidesthestandardproceduresforsolderalloyscontaininglead(Pb)andforlead-freesolderalloys.Thisstandardprovidesstandardproceduresfordeterminingthesolderabilityandresistanceofsolderingheattolead-freesolderalloys.Thisstandardprovidesstandardproceduresfordeterminingthesolderability,dissolutionofmetallization(seeB.3.3)andresistanceofsolderingheattosolderalloyswhichareeutecticorneareutectictinleadsolders.Theproceduresinthisstandardincludethesolderbathmethodandreflowmethod.ThesolderbathmethodisapplicabletotheSMDdesignedforflowsolderingandtheSMDdesignedforreflowsolderingwhenthesolderbath(dipping)methodisappropriate.ThereflowmethodisapplicabletotheSMDdesignedforreflowsoldering,todeterminethesuitabilityofSMDforreflowsolderingandwhenthesolderbath(dipping)methodisnotappropriate.TheobjectiveofthisstandardistoensurethatcomponentleadorterminationsolderabilitymeetstheapplicablesolderjointrequirementsofIEC61191-2usingeachofthesolderingmethodsspecifiedinIEC61760-1.Inaddition,testmethodsareprovidedtoensurethatthecomponentbodycanresistagainsttheheatloadtowhichitisexposedduringsoldering.
【中国标准分类号】:K04;L04
【国际标准分类号】:19_040
【页数】:30P;A4
【正文语种】:英语